AURUNA® 5000 is a neutral fine gold electrolyte for the deposition of matt yellow, fine crystalline gold coatings. It is designed for use on flexible printed circuit boards,...
Fine gold coatings with very good bonding and soldering properties
AURUNA® 5000 is a neutral fine gold electrolyte for the deposition of matt yellow, fine crystalline gold coatings. It is designed for use on flexible printed circuit boards, but can also be used without any limitations on rigid substrates.
AURUNA® 5000 coatings have a fineness of over 99.95% and a hardness of 70 - 85 HV 0.025, which means they comply with the ASTM B488 - 01 Type III Code A/B classification.
The printed circuit boards are plated in a matt nickel bath before gold plating, pre-gold plated and then coated with AURUNA® 5000. The result is gold layers with excellent bondability and solderability, high ductility and low electrical resistance.
The electrolyte is extremely easy to handle and is characterised by impressive longevity.
Electrolyte characteristics
| Electrolyte type | neutral |
| Metal content | 6 (5 - 9) g/l Au |
| pH value | 6.0 (5.8 - 6.2) |
| Operating temperature | 65 (62 - 68) °C |
| Current density range | 0.3 (0.1 - 0.5) A/dm² |
| Plating speed | approx. 0.17 μm/min at 0.3 A/dm² |
Coating characteristics
| Coating | Fine gold |
| Purity | > 99,95 % Au |
| Colour of deposit | matt yellow |
| Hardness of deposit | ≤ 85 HV 0.025, (≤ 90 HK 0.025) |
Advantages
- High power yield
- Resist-friendly operating conditions
- Excellent bondability and solderability
- Low hardness, low contact resistance
- ASTM B488 - 01 Type III Code A/B
- Easy handling
- High longevity
Applications
- Flexible and rigid printed circuit boards
